The Microelectromechanical Systems (MEMS) thrust encompasses a broad
range of activities in microfabrication and micromachining technologies
for the realization of novel sensors, advanced microactuators, and other
devices for various applications. Integrated microfabrication
technologies are being developed for silicon, gallium arsenide, glass,
polymers, and high-temperature materials such as silicon carbide. CCSM
researchers are also investigating bulk micromachining, surface
micromachining, electroplating, high aspect ratio etching, bonding
technologies, and three-dimensional processes using lasers, plasmas, and
ultrasonics. These processes will ultimately be used for wireless
communications, integrated optoelectronics; biomedical engineering; and
automotive, space, and packaging applications.
The merging of dissimilar materials and technologies is a prime focus of this thrust. For example, the extensive experience of researchers in the Microelectronics Laboratory in optoelectronics and millimeter wave integrated circuits provides a unique environment for investigating novel ways of merging these technologies with micromachined components.
In this three-inch wafer-size sheet, there are five silicon-based
tactile sensors (called "smart skin"). Three of the five sensors
measure compressive force/pressure distributed against the palmar
surface of a human hand during grasping activities while the other
sensors study the role of forces in the formation of pressure sores and
surface abrasions in wheelchair-bound subjects.
Each sensor contains arrays of pressure/force transducers, or sensing
elements. After packaging with polymers, the finished skin is flexible
and can conform to any shaped surface and provide touch sensing
capability. (The sensor itself is like a skin that can sense the
force/pressure, and at the same time it is flexible.) In the future,
the shear detection will be incorporated into the normal sensor and be
developed into a comprehensive sensitive skin.
